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8-layer TG thick copper plate
Number of floors: 8
Plate thickness: 2.3mm
Surface treatment: Tin deposition
Material Science: TG170
Minimum aperture: 0.40mm
Aspect ratio: 5.7:1
Copper hole: 25um
Copper thickness: inner layer 3oz, outer layer 3oz
Minimum line width: 10mm
Other instructions: Crimping hole process, ion contamination level ≤ 1.0ug Eq NaCl/cm.sq
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SAF Coolest v1.3.1.2 设置面板 GAGSD-AGYF-JZXZE-ZEV
图片ALT信息: Trustwine
违禁词: 第一,一流,领先,独一无二,王者,龙头,领导者,极致,